L59 微型組件 標(biāo)準(zhǔn)查詢與下載
共找到 19 條與 微型組件 相關(guān)的標(biāo)準(zhǔn)，共 2 頁
Bulging test method for mechanical properties of thin films in micro-electromechanical systems (MEMS) technology
- ICS
- 31.080.99
- CCS
- L59
- 發(fā)布
- 2024-11-28
- 實(shí)施
- 2024-11-28
Forming limit measurement method of metal film materials in micro-electromechanical systems (MEMS) technology
- ICS
- 31.080.99
- CCS
- L59
- 發(fā)布
- 2024-10-26
- 實(shí)施
- 2025-05-01
Bending test method for thin film materials for micro-electromechanical systems (MEMS) technology
- ICS
- 31.080.99
- CCS
- L59
- 發(fā)布
- 2024-10-26
- 實(shí)施
- 2024-10-26
Micro-electromechanical systems (MEMS) technology - Micro-pillar compression test method for MEMS materials
- ICS
- 31.080.99
- CCS
- L59
- 發(fā)布
- 2024-10-26
- 實(shí)施
- 2025-02-01
Environmental test methods for MEMS piezoelectric films used in MEMS technology sensors
- ICS
- 31.080.99
- CCS
- L59
- 發(fā)布
- 2024-09-29
- 實(shí)施
- 2025-01-01
Micro-electromechanical systems (MEMS) technology - Measurement method of electromechanical conversion characteristics of MEMS piezoelectric films
- ICS
- 31.080.99
- CCS
- L59
- 發(fā)布
- 2024-09-29
- 實(shí)施
- 2025-01-01
Micro-electromechanical systems (MEMS) technology Automotive-grade pressure sensor technical specifications based on MEMS technology
- ICS
- 31.080.99
- CCS
- L59
- 發(fā)布
- 2024-09-29
- 實(shí)施
- 2024-09-29
Micro-Electro-Mechanical Systems (MEMS) Technology RF MEMS Circulators and Isolators
- ICS
- 31.080.99
- CCS
- L59
- 發(fā)布
- 2024-09-29
- 實(shí)施
- 2024-09-29
Micro-electromechanical systems (MEMS) technology - Four-point bending test method for interfacial adhesion of layered MEMS materials
- ICS
- 31.080.99
- CCS
- L59
- 發(fā)布
- 2024-09-29
- 實(shí)施
- 2024-09-29
Micro-Electro-Mechanical Systems (MEMS) Technology - Wafer Curvature and Cantilever Beam Deflection Test Methods for MEMS Membrane Residual Stress
- ICS
- 31.080.99
- CCS
- L59
- 發(fā)布
- 2024-09-29
- 實(shí)施
- 2025-04-01
Micro-Electro-Mechanical Systems (MEMS) Technology Silicon-based MEMS Nanoscale Structure Impact Test Method
- ICS
- 31.200
- CCS
- L59
- 發(fā)布
- 2023-08-06
- 實(shí)施
- 2023-12-01
Micro-electro-mechanical systems (MEMS) technology silicon-based MEMS nano-thick film tensile strength test method
- ICS
- 31.200
- CCS
- L59
- 發(fā)布
- 2023-08-06
- 實(shí)施
- 2023-12-01
Bending strength test method of microelectromechanical system (MEMS) technology silicon-based MEMS microstructure
- ICS
- 31.200
- CCS
- L59
- 發(fā)布
- 2023-08-06
- 實(shí)施
- 2023-12-01
Micro-Electro-Mechanical Systems (MEMS) Technology Gyroscopes
- ICS
- 31.080.99
- CCS
- L59
- 發(fā)布
- 2023-05-23
- 實(shí)施
- 2023-09-01
Micro-Electro-Mechanical Systems (MEMS) Technical Terminology
- ICS
- 31.080.99
- CCS
- L59
- 發(fā)布
- 2023-05-23
- 實(shí)施
- 2023-09-01
Description and measurement methods of micro-groove and pyramid-like needle structures in microelectromechanical systems (MEMS) technology
- ICS
- 31.080.99
- CCS
- L59
- 發(fā)布
- 2023-03-17
- 實(shí)施
- 2023-07-01
1.1 This practice establishes procedures for the submerging of a membrane switch to verify resistant to ingress of a specified liquid. 1.2 This practice can also be used to verify the ability of a membrane switch or graphics layer to act as a liquid seal for a finished product. 1.3 Additional test methods or practices can be incorporated to investigate specific results or capabilities. 1.4 This practice is a modification of National Electrical Manufacturers Assoc. (NEMA) Publication Number 250-1991 Section 6.10, which is a test for submersion of a finished product housing. 1.5 The values states in inch-pound units are to be regarded as the standard. The values given in parentheses are for information only.
Practice for Submersion of a Membrane Switch
- ICS
- 31.220.20 (Switches)
- CCS
- L59
- 發(fā)布
- 1998
- 實(shí)施
The presence of water inside a membrane switch can affect its mechanical operation or electrical functionality, or both. Electrical failure can result as short circuits due to silver migration or exceeding the specified resistance due to oxidation. This practice establishes a procedure to verify the ability of a membrane switch to resist the entry of liquid in itself or a finished product, or both. It is useful in identifying design deficiencies. Submersion testing may be destructive, therefore any samples tested should be considered unfit for future use.1.1 This practice establishes procedures for the submerging of a membrane switch to verify resistance to ingress of a specified liquid.1.2 This practice can also be used to verify the ability of a membrane switch or graphics layer to act as a liquid seal for a finished product.1.3 Additional test methods or practices can be incorporated to investigate specific results or capabilities.1.4 This practice is a modification of National Electrical Manufacturers Assoc. (NEMA) Publication Number 250-1991 Section 6.10, which is a test for submersion of a finished product housing.1.5 The values stated in inch-pound units are to be regarded as the standard. The values given in parentheses are for information only.
Practice for Submersion of a Membrane Switch
- ICS
- 31.220.20 (Switches)
- CCS
- L59
- 發(fā)布
- 1998
- 實(shí)施
Amends and supplements the Table II, sub-group B5, and Table III, sub-groups C5 and C7 (pages 17 and 19).
Semiconductor devices; part 11: sectional specification for discrete devices; amendment 1
- ICS
- 31.080.01
- CCS
- L59
- 發(fā)布
- 1991-11
- 實(shí)施
